Chipmaker Taiwan Semiconductor Manufacturing Company (TSMC) plans to set up a second semiconductor manufacturing plant in Japan with an investment of about $7.4 billion, Japanese newspaper Nikkan Kogyo Shimbun reported.
TSMC will build the new plant in the southwestern region of Kumamoto to manufacture 5nm and 10nm chips from 2025, the report said.
A TSMC spokesperson declined to comment on the development but instead pointed to CEO CC Wei’s comment from the company’s last quarterly earnings call in January, which said, “In Japan, we are building a specialty technology fab, which will utilize 12 and 16 nanometer, and 22/28 process technologies. Volume production is scheduled for late 2024. We are also considering building a second fab in Japan, as long as the demand from customers and the level of government support makes sense.”