Intel is pledging to introduce a faster generation of processors every year through 2025 by embracing new technology that enables smaller and smaller transistors and so more powerful chips.
By 2024, the transistors will be so small they will no longer be measured in nanometers as they are today, but in angstroms, which are a tenth as big, Intel CEO Pat Gelsinger announced this week. And the chips built around the transistors will be primarily defined by how much they improve in performance per watt over the prior generation.
The roadmap Gelsinger set down is as follows:
Intel 10nm SuperFIN: In production now. This is Intel’s “Tiger Lake” generation
Intel 7: In production under the name “Adler Lake,” with 10-15% more performance/watt over the prior generation.
Intel 4 (Intel 7nm): Q2 2021 tapeout, with 20% greater performance/watt than the prior generation. “Meteor Lake” for the client, “Grand Rapids” for the Xeon.
Intel 3: Ready for manufacture in the second half of 2023.
Intel 20A: This ushers in the angstrom era. It is expected to ramp in 2024.
2025 and beyond: Intel 18A is in development for early 2025 based on expected refinements to the manufacturing process that will deliver another major jump in transistor performance.
To get down to Angstrom-sized transistors, Intel is investing in something called extreme ultraviolet (EUV) lithography, a manufacturing technique that will eventually replace the standard lithography used now. EUV is new, and that means there will be kinks to work out in the process, so expect a high manufacturing failure initially, which will translate to potential shortages.
Source:: Network World – Data Center