Western Digital begins production of the world’s tallest 3D NAND ‘skyscraper’



WD Toshiba 3D NAND BiCS

Western Digital today announced that it has kicked off production of the industry’s densest 3D NAND flash chips, which stack 64 layers atop another and enable three bits of data to be stored in each cell.

The 3D NAND flash chips are based on a vertical stacking or 3D technology that Western Digital and partner Toshiba call BiCS (Bit Cost Scaling). WD has launched its pilot production of its first 512 gigabit (Gb) 3D NAND chip based on the 64-layer NAND flash technology.

Toshiba

The industry’s densest 3D NAND flash chips are based on a vertical stacking or 3D technology that Western Digital and partner Toshiba call BiCS (Bit Cost Scaling). Their latest memory stores three bits of data per cell and stacks those cells 64 layers high.

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