WD preparing to ship flash chips with half a terabit of capacity

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Western Digital (WD) has begun manufacturing the third generation of its 3D NAND flash chips, which increases the number of layers from 48 to 64 and will allow it to double capacity.

Pilot production of the new 64-layer chips has already started in WD’s Yokkaichi, Japan joint venture fabrication plant; initial shipments are expected in the fourth quarter of this year with “meaningful commercial volumes” beginning in the first half of 2017.


Toshiba’s 48-layer 3D NAND chips.

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